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Signatone
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WL-310 DATA SHEET
Data Sheet · RF / mmW Probe Systems

Signatone WL-310 300 mm Manual Probe System

for reliable and accurate DC/CV, RF and mmW measurements

Features / Benefits

Designed for a Variety of On-Wafer Analytical

Measurement Applications

Product Versatility

Options and Configurations

Roll - Out Stage

Chuck XY Stage (Manual)
Travel range305 mm x 305 mm (12 x 12 in)
Travel Resolution (standard)14 μm Per Degree of Knob Rotation
Travel Resolution (Fine)1.5 μm Per Degree of Knob Rotation
Drive MechanismPrecision Leadscrew – Carriage and Rails
Chuck Z Stage (Pneumatic)
Travel range2.5 mm (0.01 in)
Repeatability± 1.0 μm
Z Stage DrivePneumatic Precision Lift
Chuck To Platen (Manual Adjust)
Separation (Quick Lift)3.175mm (1/8”)
Separation (Fine Lift)38.1mm (1.5”)
Chuck Theta Stage (Manual)
Travel range± 11° (22°)
Resolution0.01mm Per Degree of Knob Rotation
Accuracy< 1.0 μm (measured at the edge of the 300 mm chuck)
Repeatability< 1.5 μm
Theta Stage DriveHigh Resolution Micrometer
Roll Out / Loading Stage
Travel range285mm
Presentation95%
Return repeatability< 1μm
Manual Microscope Stage (linear)
Movement range50mm X 50mm (2”x2”)
Resolution< 2µm (2 x 10-4 mils)
Scope lift101 mm (4”) Vertical Pneumatic (Manual Knob- optional)

Specifications

Probe Platen

Specifications
MaterialNickel Plated Steel (Al optional)
DimensionL = 580mm x W = 637mm x H = 12.7mm (See drawing)
Max. No of Micro Positioners8x DC or 4x DC + 2x RF or 2x DC + 4x RF or 4x DC + 4x RF
Quick Platen Lift Control (CVL)Continuous Variable Lift (0 to 3.175 mm)
Contact Repeatability< 1 µm (0.04 mils) by Manual Control
RF MicroPositioner mountingMagnetic or Bolt Down
DC MicroPositioner mountingMagnetic or Vacuum

Universal Platen Designed for Multiple Probe Configurations

Sample Probe Configured with 4 RF + 4 DC Probes in Local Enclosure

Signatone Multi Benefit Ergonomically Correct Platen Adjust and Features:

Platen “Fine Adjust” and “Position Lock”

Platen “Quick Lift”

Dc Probe –Selection Guide

Coax Probe (C)Triax Probe (T)Kelvin Probe (K)
Max voltage500 V500 V500 V
Temperature range-60 °C to 300 °C-60 °C to 300 °C-60 °C to 300 °C
Leakage current< 50fA< 20fA< 20fA
ConnectivityBNCStandard TriaxSSMC
Connectivity typeSingle CoaxialSingle low noise TriaxialForce/Sense Coax
Characteristics impedance50 Ohms50 Ohms50 Ohms
Residual capacitance< 80fF< 80fF< 80fF
Probe holder materialBrassBrassBrass
Probe tips materialTungstenTungstenTungsten
Probe tips sizes0.5 µm – 25 µm0.5 µm – 25 µm0.5 µm – 25 µm
Minimum pad size25 µm x 25 µm25 µm x 25 µm25 µm x 25 µm

Coax Probe

Triax Probe

Coax Kelvin Probe

*All leakage tests conducted in an enclosed environment with Keithley 4200, or equivalent, in sampling mode with 10 PLC, auto-ranging. 0.25s interval

Rf Probe –Selection Guide

Cable Interface
SP-40ASP-50ASP-67ASP-110HSP-145
FrequencyDC-40GHzDC-50GHzDC-67GHzDC-110GHzDC-145GHz
Connector2.92mm2.4mm1.85mm1.0mm0.8mm
Tip ConfigurationGS/SG/GSGGS/SG/GSGGS/SG/GSGGS/SG/GSGGSG
Pitch Range50µ - 2540µ50µ - 1250µ50µ - 1250µ50µ - 1250µ50µ - 200µ
Insertion Loss<.8db<1.0db<1.1db<1.5db<1.75db
Return Loss> 18db>18db>14db>15db>15db
Calibration Substrates
GSGSP-CS-5SP-CS-9SP-CS-10SP-CS-18
Pad Size50µ X 50µ100µ X 100µ150µ X 150µ300µ X 300µ
100µ X 100µ
150µ X 150µ
Pitch Range75µ - 250µ250µ - 600µ600µ - 1250µ1250µ - 2540µ
GS/SGSP-CS-8SP-CS-14SP-CS-11SP-CS-17
Pad Size50µ X 50µ100µ X 100µ150µ X 150µ300µ X 300µ
100µ X 100µ
150µ X 150µ
Pitch Range50µ - 200µ200µ - 400µ400µ - 1250µ750µ - 2540µ
GSG > 110GHzSP-CS-15
Pad Size25µ X 25µ
Pitch Range40µ - 150µ (SOLT)
30µ - 150µ (LRM)
RF Cables
RFC-40RFC-50RFC-67RFC-110
Frequency RangeDC - 40GHzDC - 50GHzDC - 67GHzDC - 110GHz
Length4 Ft.4 Ft.3 Ft.*
Connectors2.92 M – 2.92 F2.4 M – 2.4 F1.85 M - 1.85 F1.0 M - 1.0 F
* Contact Factory
Standard Wafer Chuck
ConnectivityCoax BNC (m)
Diameter308 mm
MaterialNickel Plated Brass (gold optional)
Chuck surfaceZone selector knob with Peppered vacuum patterns
Vacuum hole pattern sections(diameter)22mm, 50mm, 91mm, 135mm, 168mm, 265mm
Vacuum actuationSelector Knob allows individual activation of vacuum zones
Supported DUT sizes25mm, 75mm, 100mm, 150mm, 200mm, 300mm
Surface planarity±6.5µ
Rigidity<3µ / 10N at edge of the chuck
Electrical Specification (Coax)
Operation voltageDesigned for operation at -200V to + 200VDC
Maximum voltage between chuck top500 V DC
and GND
Isolation> 150 GΩ
Wafer Chuck (Triaxial)
ConnectivityTriax (m)
Diameter308 mm
MaterialGold Plated Brass
Chuck surfaceIndependent Vacuum zones with vacuum rings
Vacuum hole pattern sections(diameter)0mm, 65mm, 112mm, 162mm, 265mm
Vacuum actuationMulti-Zone Adjustable Control
Supported DUT sizes3mm, 75mm, 125mm, 200mm, 300mm
Surface planarity± 5 µm
Rigidity<3µ / 10N near at edge of the chuck
Electrical Specification (Triax)
Chuck isolationMeasured @ 10V DC
Force to guard> 2 TΩ
Guard to shield> 7 TΩ
Force to shield> 15 TΩ

Non-Thermal Chucks

Signatone Thermal Chucks

Typical Specifications of Signatone Thermal Technology
300mm Standard Hot300mm Hot/ Triax300mm Hot/ 3kV Triax
Temperature Range+25 °C to +300 °C+25 °C to +200 °C+25 °C to +200 °C
ConnectivityCoax (m)Triax (m)HV Triax (m)
Temperature control methodLiquid Cooled / Resistance heaterLiquid Cooled / Resistance heaterLiquid Cooled / Resistance heater
CoolantWaterWaterWater
Smallest temperature selection step0.1 °C0.1 °C0.1 °C
Chuck temperature display resolution0.01 °C0.01 °C0.01 °C
External touchscreen display operationYesYesYes
Temperature stability±0.1 °C±0.1 °C±0.1 °C
Temperature accuracy±0.5 °C±0.5 °C±0.5 °C
Control methodLow noise DC/PIDLow noise DC/PIDLow noise DC/PID
InterfacesRS232C & TCP/TCIPRS232C & TCP/TCIPRS232C & TCP/TCIP
Optional InterfacesGP-IBGP-IBGP-IB
Chuck surface platingNickelGoldGold
Temperature sensorRTDRTDRTD
Temperature uniformity±0.5 °C at ≤ 200 °C ±1.5 °C at > 200 °C±0.5 °C at ≤ 100 °C ±2.5 °C at 200 °C±0.5 °C at ≤ 100 °C ±3.5 °C at 200 °C
Surface flatness< ±10 µm< ±8 µm< ±15µ
Electrical isolation - Coax BNC (m) / SHV Triax150nA> 5TΩ> 5TΩ
Heating Rates25°C to 300°C < 12 min25°C to 200°C < 9 min25°C to 200°C < 28 min
Cooling Rates300°C to 25°C < 9min200°C to 25°C < 8min200°C to 25°C < 8min
Leakage @ 10 V Kelvin TriaxN/A<25fA<400fA
Residual Capacitance<200fF<1pF
Maximum voltage between chuck top and GND500V500V3kV
3 Safety CircuitsYesYesYes
Vacuum PatternRingsPin holePin hole
Vacuum Zone (DUT Size)50, 100, 150, 200,300mm2, 50, 100, 150, 200,300mm2,50, 100, 150, 200, 300mm
System Controller / Dimensions /Weight / Power Consumption
System ModelW x D x H (mm)Weight (kg)Weight (Lbs.)Power cons. (VA)
S-1080558 x 483 x 17820.4452000
Chiller355 x 711 x 61050.81121500
Auxiliary Chuck
Quantity1-2 AUX chucks *
PositionIndependently isolated (located on back left and right )
Substrate Size (L x W)Max 25mm x 25mm (1”x 1”)
MaterialCeramic, Ultem, or NI plated brass
Surface Planarity≤± 5 µm
Vacuum ControlControlled independently, separate from wafer chucks

System Dimensions Including Table

Dimensions (L x D x H)1093x 1085 x 1700 mm (43 x 42.7 x 66.9 In )
Weight635 kg (1400 lbs.)

WL-350 / Vibration Isolation Table /Monitor

* Can very dependent on monitor, keyboard (roll out drawer) position and Microscope selection

Warranty

* See Signatone Corporate Terms and Conditions of Sale for further details.

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